Intel SSD DC P3700 Series PCI-E, 400GB, 2700MBs read, 1080MBs write, random 4k 70/30 read/write 150 000iops, 17 Drive Writes/day, NVME, ultra low latency

Intel SSD DC P3700 Series PCI-E, 400GB, 2700MBs read, 1080MBs write, random 4k 70/30 read/write 150 000iops, 17 Drive Writes/day, NVME, ultra low latency

Intel DC P3700 Half-Height/Half-Length (HH/HL) 400 GB PCI Express 3.0 MLC NVMe

Intel DC P3700, 400 GB, Half-Height/Half-Length (HH/HL), 2700 MB/s

SSDPEDMD400G401

Breakthrough performance
The Intel® Solid-State Drive Data Center Family for PCIe brings extreme data throughput directly to Intel® Xeon® processors with up to six times faster data transfer speed than 6 Gbps SAS/SATA SSDs. The performance of a single drive from the Intel SSD Data Center Family for PCIe, specifically the Intel® Solid-State Drive Data Center P3700 Series (460K IOPS), can replace the performance of 7 SATA SSDs aggregated through a host bus adapter (HBA) (approximately 500K IOPS).

Modernizes data center storage
Intel led the industry in creation of a new Non-Volatile Memory Express (NVMe) storage interface standard. NVMe overcomes SAS/SATA SSD performance limitations by optimizing hardware and software to take full advantage of NVM SSD technology.

Comprehensive solution
Intel is driving transition to NVMe SSDs by providing a comprehensive product line, enabling extensive system compatibility, delivering Intel drivers as well as supporting industry driver development, and completing numerous industry standard compliance certifications.

Proven quality and reliability
Intel SSD Data Center Family for PCIe devices are based on Intel-developed controller, firmware, and leading manufacturing process NAND flash memory. Rigorous qualification and compatibility testing ensures a highly reliable SSD. The Intel® SSD Data Center Tool provides a powerful set of management capabilities.
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Specificaties
Features
SSD form factor
Half-Height/Half-Length (HH/HL)
SSD capacity
The Solid State Drive's data storage capacity.
400 GB
Interface
Interface ports to connect pieces of equipment. USB (Universal Serial Bus) has become the most popular wired interface to connect peripherals. USB 2.0 supports speeds up to 480 Mbit/s (USB 1: 12 Mbit/s). The interface FireWire is also known as the IEEE 1394 standard. Enhanced IDE (EIDE)is sometimes referred to as Fast ATA, Fast IDE or ATA-2.
PCI Express 3.0
Memory type
Type of memory in the device e.g. DDR3, SRAM (Static RAM).
MLC
NVMe
NVM Express (NVMe) or Non-Volatile Memory Host Controller Interface Specification (NVMHCIS) is an open logical device interface specification for accessing non-volatile storage media attached via a PCI Express (PCIe) bus. NVM Express, as a logical device interface, has been designed to capitalize on the low latency and internal parallelism of solid-state storage devices.
Read speed
The speed at which a device can read data.
2700 MB/s
Write speed
The speed at which a device can write data.
1080 MB/s
Random read (4KB)
450000 IOPS
Random write (4KB)
75000 IOPS
Random read (8KB)
275000 IOPS
Random write (8KB)
32000 IOPS
Random read (100% span)
450000 IOPS
Random write (100% span)
75000 IOPS
Read latency
20 µs
Write latency
20 µs
Lithography
20 nm
PCI Express interface data lanes
x4
PCI Express CEM revision
2.0
End-to-End Data Protection
Enhanced Power Loss Data Protection technology
SSD temperature monitoring
Uncorrectable Bit Error Rate (UBER)
<1 sector per 10^17 bits read
Mean time between failures (MTBF)
Statistical model used to indicate product/mechanism reliability; expressed in hours and percentage of duty cycle. This number (in hours) does not indicate the mean time before failure for a single unit/mechanism.
2.000.000 Hrs
Market segment
SRV
SSD usage tag
Data center
SSD ARK ID
79624
RoHS compliance
The Restriction of Hazardous Substances (RoHS) Directive aims to restrict certain dangerous substances commonly used in electrical and electronic equipment. Any RoHS compliant product is tested for the presence of Lead (Pb), Cadmium (Cd), Mercury (Hg), Hexavalent chromium (Hex-Cr), Polybrominated biphenyls (PBB), and Polybrominated diphenyl ethers (PBDE). PBB and PBDE are flame retardants used in several plastics. For Cadmium and Hexavalent chromium, there must be less than 0.01% of the substance by weight at raw homogeneous materials level. For Lead, PBB, and PBDE, there must be no more than 0.1% of the material, when calculated by weight at raw homogeneous materials. Any RoHS compliant component must have 100 ppm or less of mercury and the mercury must not have been intentionally added to the component. In the EU, some military and medical equipment are exempt from RoHS compliance.
Certification
UL, CE, C-Tick, BSMI, KCC, Microsoft WHQL, VCCI
Power
Power consumption (idle)
4 W
Brand-specific features
Intel High Endurance Technology (HET)
Operational conditions
Operating temperature (T-T)
The minimum and maximum temperatures at which the product can be safely operated.
0 - 55 °C
Storage temperature (T-T)
The minimum and maximum temperatures at which the product can be safely stored.
-55 - 95 °C
Operating vibration
Environmental requirements for vibration in operating mode
2.17 G
Non-operating vibration
Environmental requirements for vibration in non-operating mode
3.13 G
Operating shock
Environmental requirements for optimal protection from impact in operating mode
50 G
Maximum non-operating altitude
12192 m
Maximum operating altitude
3048 m
Weight & dimensions
Weight
Weight of the product without packaging (net weight). If possible, the net weight is given including standard accessories and supplies. Please note that sometimes the manufacturer leaves out the weight of accessories and/or supplies.
185 g
Other features
Product colour
The colour e.g. red, blue, green, black, white.
Gray
Internal
The product is built in.
Processor lithography
The process which is performed by the processor e.g. CPU (Central Processing Unit).
20 nm
Born on date
Q2'14
Drive capacity
400 GB
Launch date
Q2'14
Product brief URL
http://www.intel.com/content/dam/www/public/us/en/documents/product-briefs/intel-ssd-dc-family-for-pcie-brief.pdf
Product name
Intel SSD DC P3700 Series (400GB, 1/2 Height PCIe 3.0, 20nm, MLC)
SSD endurance rating
7.3 PBW (JEDEC Workload), 10 DWPD
SSD power consumption (active)
12W (write), 9W (read)
SSD power consumption (idle)
4W
SSD shock
50 G Trapezoidal, 170 in/s
SSD weight
185gm
Sequential reading
2700 MB/s
Sequential writing speed
1080 MB/s
Status
Discontinued
Last change
63903513
Product family
Data center SSD
Product series
Intel DC P3700
Product codename
Fultondale
Fouten voorbehouden. Alle productbeschrijvingen zijn indicatief en niet bindend.